Nano-MAX® 15inch Shave Lapping Machine NM-380FV

It fits SMD surface crystal,optic crystal,optic glass,shaphire semiconductor silicon slice, quartzcrystal slice, piezoelectricity porcelain, arsenide gallium,LiNb03, molybdenum slice and metal, nonmetal brittleness material  single side polishing and rubbing of pressurizing components.

Grinding can be defined as the rapid removal of material from a sample either to reduce it to a suitable size or to remove large irregularities from the surface. the grinding wheel or plate typically rotates at a high speed(around 200-1000rpm)and a coarse, bonded abrasive(＞40μm) is used. Grinding is quick and relatively easy process but can cause deep subsurface damage in delicate materials. typically grinding is applied to hard metals such as high carbon steels where rapid removal is essential and subsurface damage is not a critical parameter. For delicate materials the grinding process must be a balance of material removal and subsurface damage. In many cases it is advisable to initially cut the specimen with a gentle mechanical method such as a wire saw. A properly prepared wire saw cut sample can eliminate the grinding process altogether.